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Gerber File Multilayer Printed Circuit Board , Prototype Circuit Board Assembly

Categories Multilayer PCB Board
Brand Name: OEM ODM
Model Number: SL81104S18
Certification: UL, Rohs
Place of Origin: China
MOQ: No MOQ
Price: Negotiation
Payment Terms: T/T, Western Union, MoneyGram,Paypal
Supply Ability: 30000pcs per day
Delivery Time: 5-7 days
Packaging Details: ESD Bag
Sample order: Acceptable
Service available: OEM acceptable
Specialized in: High-precision
Features 1: Gerber/PCB File Needed
Features 2: 100% E-test
Features 3: Quality 2 Years Guarantee
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    • Product Details
    • Company Profile

    Gerber File Multilayer Printed Circuit Board , Prototype Circuit Board Assembly

    Gerber file multilayer pcb customed prototype printed circuit board


    Multilayer PCB board


    Shenzhen Shinelink Technology LTD. is a professional design company of printed circuit board and printed circuit board assembly manufacturing, dedicated to the Research ,Development,Production, Sales and Service of PCB and PCBA products for more than 14 years!


    Advantages


    - No MOQ

    - OEM services provided

    - Heavy copper PCB, Heavy gold PCB, Blind / Buried via PCB, High layer count PCB manufacturable

    - Factory direct price

    - Replying with price in one working day

    - Shipping within 24 hours

    - Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free


    PCB Capacity


    PCB General Capability

    Number of Layer

    1 - 18 Layer

    Maximum Processing Area

    680 × 1000MM

    Min Board Thickness

    2 Layer - 0.3MM ( 12 mil )

    4 Layer - 0.4MM ( 16 mil )

    6 Layer - 0.8MM ( 32 mil )

    8 Layer - 1.0MM ( 40 mil)

    10 Layer - 1.1MM ( 44 mil )

    12 Layer - 1.3MM ( 52 mil )

    14 Layer - 1.5MM ( 59 mil )

    16 Layer - 1.6MM ( 63 mil )

    18 Layer - 1.8MM ( 71 mil )

    Finished Board Thickness Tolerance

    Thickness ≤ 1.0MM, Tolerance: ± 0.1MM

    1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%

    Twisting and Bending

    ≤ 0.75%, Min: 0.5%

    Range of TG

    130 - 215 ℃

    Impedance Tolerance

    ± 10%, Min: ± 5%

    Hi-Pot Test

    Max: 4000V/10MA/60S

    Surface Treatment

    HASL, With Lead, HASL Free Lead

    Flash Gold, Immersion Gold

    Immersion Silver, Immersion Tin

    Gold Finger, OSP

    PCB Cu Thickness + Plating

    Out Layer Cu Thickness

    1 - 6OZ

    Inner Layer Cu Thickness

    0.5 - 4OZ

    Cu Thickness of PTH

    20UM ≤ Average ≤ 25UM

    Min: 18UM

    HASL with Lead

    Tin 63% Lead 37%

    HASL Free Lead

    7UM ≤ Surface Thickness ≤ 12UM

    Thick Gold Plating

    Ni Thickness: 3 - 5UM ( 120u" - 200u" )

    Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" )

    Immersion Gold

    Ni Thckness: 3 - 5UM ( 120u" - 200u" )

    Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" )

    Immersion Silver

    Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" )

    Gold Finger

    Ni Thickness: 3 - 5UM ( 120u" - 160u" )

    Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" )

    U940 PCB Pattern Limit Capability


    Min Width

    0.075MM ( 3 mil )

    Min Trace

    0.075MM ( 3 mil )

    Min Width of Ring ( Inner Layer )

    0.15MM ( 6 mil )

    Min Width of Ring ( Out Layer )

    0.1MM ( 4 mil )

    Min Solder Bridge

    0.1MM ( 4 mil )

    Min Height of Legend

    0.7MM ( 28 mil )

    Min Width of Legend

    0.15MM ( 6 mil )

    PCB Holes Processing Capability

    Final Hole Size

    Min: Laser 0.1MM, Machine 0.2MM

    Drilling Hole Size

    0.10 - 6.5MM

    Drilling Tolerance

    NPTH: ±0.05MM, PTH: ±0.075MM

    Final Hole Size Tolerance ( PTH )

    φ0.20 - 1.60MM ± 0.075MM

    φ1.60 - 6.30MM ± 0.10MM

    Final Hole Size Tolerance ( NPTH )

    φ0.20 - 1.60MM ± 0.05MM

    φ1.60 - 6.50MM ± 0.05MM

    Drilling Strip Hole

    -0L ~tu.'gth /width 2:1

    Min Strip Hole Width 0.65MM

    Length & Width Tolerance ± 0.05MM

    Board Thickness / Hole Size

    ≤ 10:1

    PCB Cover Thickness Capability

    Solder Mask Color

    Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White

    Solder Mask Thickness

    Surface Line ≥ 10UM

    Surface Line Corner ≥ 6UM

    Surface Board 10 - 25UM

    Solder Mask Bridge Width

    Legend Color

    White,Yellow,Black

    Min Height of Legend

    0.70MM ( 28 mil )

    Min Width of Legend

    0.15MM ( 6 mil )

    Blue Gel Thickness

    0.2 - 1.5MM

    Blue Gel Tolerance

    ±0.15MM

    Carbon Print Thickness

    5 - 25UM

    Carbon Print Min Space

    0.25MM

    Carbon Print Impedance

    200Ω

    Blind/Burried/Half Via PCB Capability


    Parameters

    (1+1)e.g.

    (4-layer)blind via:1-2,2-4

    (6-layer)buried via:2-3,3-4

    (8-layer)blind/buried:1-3,4-5,6-8

    Min Via

    Laser 0.1MM, Machine 0.2MM

    Half Via

    Min: 0.6MM

    Impedance Capability

    Resistance Value

    Single-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω


    PCB Photos


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